Page 7 - MICRO SWITCH Hermetic Sealed Basic Switches
P. 7

MICRO SWITCH™ Hermetic Sealed Basic Switches                                                 O.F. •  Operating force

                                                                                                     R.F. •  Release force
                                                                                                     P.T.  •  Pretravel
        MICRO SWITCH™ HM SERIES PRODUCT SPECIFICATIONS AND LISTINGS                                  O.T. •  Overtravel
                                                                                                     D.T. •  Differential travel
        Contact your Honeywell rep or distributor for additional listings                            O.P. •  Operating position

                                  Elect. Rating   Spec. (page 5)  max.  max.                       mm      Comment
                                                                              P.T.
                                                                                            D.T.
                                                                                     O.T.
                       Catalog          Temperature    Termi-    O.F.   R.F.   max.   min.   max.   O.P.
                        Listing           range        nation   g [oz]  g [oz]  mm   mm     mm      [in]
                                                                              [in]
                                                                                      [in]
                                                                                             [in]
                     11HM1               A  -184 °C to 121 °C   Thru-hole   198 [7]  28 [1]  0,76   0,08   0,15   8,38   MIL-PRF 8805
                     [MS 27216-5]     [-300 °F to 250 °F]  solder post        [0.03]  [0.003]  [0.006]  [0.33]  applications
                     11HM1        G    -65 °C to 125 °C         Thru-hole   198 [7]  28 [1]  0,76   0,08   0,15   8,38   UL 508
                     [UL 508]          [-85 °F to 257 °F]  solder post        [0.03]  [0.003]  [0.006]  [0.33]  applications

                                      -184 °C to 121 °C   Thru-hole           0,76   0,08   0,15   8,38      Gold
                     13HM1        B                             198 [7]  28 [1]
                                      [-300 °F to 250 °F]  solder post        [0.03]  [0.003]  [0.006]  [0.33]  contacts
                                                                                                         MIL-PRF 8805,
                     9HM1             -184 °C to 121 °C   Thru-hole           0,76   0,08   0,15   8,38
                     [MS27216-6]  C   [-300 °F to 250 °F]  solder post  198 [7]  28 [1]  [0.03]  [0.003]  [0.006]  [0.33]  bifurcated gold
                                                                                                           contacts
                                                                                                            UL 508
                     9HM1         F    -65 °C to 125 °C         Thru-hole   198 [7]  28 [1]  0,76   0,08   0,15   8,38   applications,
                     [UL 508]          [-85 °F to 257 °F]  solder post        [0.03]  [0.003]  [0.006]  [0.33]  bifurcated gold
                                                                                                           contacts
                                                      Wire leads
                     2HM19-1      D    -65 °C to 125 °C         (3) 305 mm   198 [7]  28 [1]  0,76   0,08   0,15   8,38   MIL-PRF 8805
                     [MS27216-2]       [-85 °F to 257 °F]                     [0.03]  [0.003]  [0.006]  [0.33]  applications
                                                       [12 in]
                                                      Wire leads
                     2HM19-5      D    -65 °C to 125 °C         (3) 1524 mm  198 [7]  28 [1]  0,76   0,08   0,15   8,38   MIL-PRF 8805
                     [MS27216-4]       [-85 °F to 257 °F]                     [0.03]  [0.003]  [0.006]  [0.33]  applications
                                                       [60 in]
                                       -65 °C to 260 °C
                                       [-85 °F to 500 °F]   Wire leads        0,76   0,08   0,15   8,38   Up to 260 °C
                     16HM1-1      A                  (3) 305 mm   198 [7]  28 [1]
                                      (-184 °C [-300 °F]                      [0.03]  [0.003]  [0.006]  [0.33]  [500 °F]
                                      if wires non-flexing)  [12 in]
                                       -65 °C to 260 °C         Thru-hole     0,76   0,08   0,15   8,38   Up to 260 °C
                     15HM2        A                             198 [7]  28 [1]
                                       [-85 °F to 500 °F]  post               [0.03]  [0.003]  [0.006]  [0.33]  [500 °F]
                                      -184 °C to 260 °C   Thru-hole           0,76   0,08   0,10   8,38   Up to 260 °C
                     15HM5        A                             198 [7]  28 [1]
                                      [-300 °F to 500 °F]  solder post        [0.03]  [0.003]  [0.004]  [0.33]  [500 °F]
                                      -184 °C to 260 °C   Thru-hole           0,76   0,08   0,15   8,38   Up to 260 °C
                     5HM1         E                             198 [7]  28 [1]
                                      [-300 °F to 500 °F]  solder post        [0.03]  [0.003]  [0.006]  [0.33]  [500 °F]
                     5HM1         J    -65 °C to 260 °C         Thru-hole   198 [7]  28 [1]  0,76   0,08   0,15  8,38   UL 508
                     [UL 508]          [-85 °F to 500 °F]  solder post        [0.03]  [0.003]  [0.006]  [0.33]  applications
                                      -184 °C to 260 °C   Thru-hole           0,76   0,08   0,15   8,38   Up to 260 °C
                     19HM1        C                             198 [7]  28 [1]
                                      [-300 °F to 500 °F]  solder post        [0.03]  [0.003]  [0.006]  [0.33]  [500 °F]
                     19HM1        H    -65 °C to 260 °C         Thru-hole   198 [7]  28 [1]  0,76   0,08   0,15  8,38   UL 508
                     [UL 508]          [-85 °F to 500 °F]  solder post        [0.03]  [0.003]  [0.006]  [0.33]  applications

                     19PA137-                                                                               Force
                     HM*          –         –            –        –     –      –      –       –     –      spreading
                                                                                                             plate
        * Recommended to minimize force on housing of HM switch and any resulting damage to switch housing.
        Note: Torque on #2 mounting screws must not exceed 0,17 Nm [1.5 in-lb]. The force spreading plate, 19PA137-HM, will allow up to 0,28 Nm [2.5 in-lb] of mounting torque.











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